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NTD4815N, NVD4815N
Power MOSFET
30 V, 35 A, Single N ? Channel, DPAK/IPAK
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? AEC ? Q101 Qualified and PPAP Capable ? NVD4815N
? These Devices are Pb ? Free and are RoHS Compliant
Applications
? CPU Power Delivery
? DC ? DC Converters
? High Side Switching
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
30 V
G
http://onsemi.com
R DS(ON) MAX
15 m W @ 10 V
25 m W @ 4.5 V
D
I D MAX
35 A
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
30
± 20
V
V
S
N ? CHANNEL MOSFET
Continuous Drain
Current R q JA
(Note 1)
T A = 25 ° C
T A = 85 ° C
I D
8.5
6.5
A
4
4
2 3
Power Dissipation
R q JA (Note 1)
Continuous Drain
Current R q JA
(Note 2)
Power Dissipation
R q JA (Note 2)
Steady
State
T A = 25 ° C
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
P D
ID
P D
1.92
6.9
5.3
1.26
W
A
W
1 2
3
CASE 369AA
DPAK
(Bent Lead)
STYLE 2
1
CASE 369AC
3 IPAK
(Straight Lead)
Continuous Drain
Current R q JC
(Note 1)
T C = 25 ° C
T C = 85 ° C
I D
35
27
A
MARKING DIAGRAMS
& PIN ASSIGNMENTS
Power Dissipation
R q JC (Note 1)
Pulsed Drain
Current
t p =10 m s
T C = 25 ° C
T A = 25 ° C
P D
I DM
32.6
87
W
A
4
Drain
4
Drain
Current Limited by Package
T A = 25 ° C
I DmaxPkg
35
A
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Drain to Source dV/dt
Single Pulse Drain ? to ? Source Avalanche
Energy (V DD = 24 V, V GS = 10 V,
I L = 11 A pk , L = 1.0 mH, R G = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T J ,
T STG
I S
dV/dt
EAS
T L
? 55 to
+175
27
6
60.5
260
° C
A
V/ns
mJ
° C
2
1 Drain 3
Gate Source
Y
WW
4815N
G
1 2 3
Gate Drain Source
= Year
= Work Week
= Device Code
= Pb ? Free Package
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
? Semiconductor Components Industries, LLC, 2011
October, 2011 ? Rev. 7
1
Publication Order Number:
NTD4815N/D
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